特点Product Feature:
lTG>180(DSC)
l低DK,低DF材料
Low Dk, Low Df material
l高可靠性,满足4.4mm的32层PCB性能要求
High reliability, meeting 4.4mm 32-layer PCB performance requirements
l耐CAF性能,适用无铅制程
CAF resistance, suitable for lead-free process
应用Applications:
l高端服务器
Suitable for 2~18 layer PCB production, applied to the server
l4G、5G通讯核心网组件
Core components of 4G and 5G communication networks
l光模块
Optical Module
l高性能计算机
High-performance computers
l毫米波雷达项目
Millimeter wave radar project
| 检测项目 Test Item | 单位 Units | 检测条件 Test Conndition | 测试方法(IPC TM650) Test Method | 典型值 Typical Value | |
| 玻璃化温度(Tg) Glass Transition Temperature | ℃ | DSC | 2.4.25 | 192 | |
| 表面电阻 Surface Resistance | ㏁ | After Moisture | 2.5.17.1 | 1.0*108 | |
| 体积电阻 Volume Resistance | ㏁.cm | After Moisture | 2.5.17.1 | 1.0*109 | |
| 介电常数(Dk) Permittivity | — | 1GHz C24/23/50 | 2.5.5.9 | 3.5 | |
| 介质损耗角正切(Df) Loss Tangent | — | 1GHz C24/23/50 | 2.5.5.9 | 0.002 | |
| 剥离强度(1oz) Peel Strength | N/mm | 万用拉力机 universal tension machine | 2.4.8 | 1.1 | |
| 热应力 | S | 288℃浸锡 288℃ Immersion Tim | 2.4.13.1 | >120S | |
| 热裂解温度(Td) Decomposition Temperature | ℃ | weight loss 5% | TGA | 360 | |
| CTE | Alpha 1 | ppm/℃ | TMA | 2.2.24 | 42 |
| Alpha 2 | ppm/℃ | 2.2.24 | 240 | ||
| 50~260℃ | % | 2.2.24 | 2.3 | ||
| 耐电弧性 Arc Resistance | S | D48/50-D0.5/23 | 2.5.1 | 130 | |
| 吸水率 Water absorption | % | D24/23 | 2.6.2.1 | 0.14 | |
| 弯曲强度 | N/mm2 | LW/CW | 2.4.4 | 595/498 | |
| 击穿电压 Breakdown Voltage | KV | D48/50+D0.5/23 | 2.5.6 | 60 | |
| 耐燃性 Flame Resistance | Rating | E24/125 | UL94 | V-0 | |
| 漏电指数(CTI) Comparative Tracking Index | Rating | C-96/20/65 | IEC-60112 | PLC-2 | |
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